Capabilities
Technical Capabilities & Manufacturing Specs
Designed to meet the rigorous demands of High-Performance Computing, Edge AI, and Mission-Critical Systems.
| Category | Parameter | Specification/Capability |
|---|---|---|
| Board Specs |
Max Layer Count Max Board Size Min Board Thickness Base Materials |
Up to 30 Layers 500 X 450 mm 0.2 mm FR-4, High-Tg, Rogers, Polymide, Metal Core |
| Component Support |
Min Component Size Fine Pitch Package Types |
01005 (imperial) / 0402 (metric) Down to 0.25 mm pitch BGA, Micro-BGA, LGA, QFN, CSP, PoP (Package on Package) |
| Manufacturing |
SMT Lines Thru-Hole Assembly |
Fully Automated High-Speed SMT Manual and Wave Soldering Double-sided SMT, Mixed Technology |
| Advanced Features |
HDI Technology Impedance Control |
Blind & Buried Vias, Laser-drilled Microvias +/- 5% precision |
| Quality & Test |
Inspection Testing Standards |
3D AOI, 3D X-Ray (AXI) Functional (FCT) IPC-A-610 Class 2 & 3, J-STD-001 |